Mine design and planning

What is liquid cooled data center, submerged liquid cooled mine

Immersion liquid cooling technology is a kind of cooling technology that takes liquid as heat transfer medium, the heating device is immersed in liquid, and heat exchange is carried out through direct contact. By replacing air with liquid, the heat generated by it heating devices such as CPU and memory can be taken away. Before, liquid cooling technology can be described as a hundred flowers bloom. The common ones are cold plate liquid cooling, immersion liquid cooling and air-liquid mixing.

What are the advantages of liquid cooling data center?

Submerged liquid cooled mine
Submerged liquid cooled mine

First, the efficient refrigeration of liquid cooling technology can effectively improve the efficiency and stability of the server. Liquid has better heat transfer effect, which is 25 times that of air. The temperature transfer effect is faster and better, which can realize the efficient refrigeration of IT equipment.

Second, the application of liquid cooling technology helps to achieve energy saving and noise reduction in the data center. Firstly, compared with the traditional air-cooled data center, the liquid cooled data center removes the air-conditioning system and the corresponding air-cooled infrastructure, and increases the circulating pump, which can save the construction cost.

Third, the application of liquid cooling technology in the data center can greatly improve the efficiency of the data center. Although the liquid cooling data center adds pumps and coolant systems, it saves the construction of air conditioning system and corresponding infrastructure, saves a lot of space and can accommodate more servers.

Fourth, the liquid cooling server can ignore the environmental impact such as altitude and region. No matter where you decide to locate, you can deploy data centers with more consistent cooling infrastructure around the world.

Fifth, the waste heat of liquid cooled data center can create economic value. The heat of liquid cooling data center takes liquid as the carrier, which can be directly connected to the building heating system and water supply system through heat exchange to meet the heating, warm water supply and other needs of nearby residents. It not only saves energy, but also creates added value for the data center.

Classification of liquid cooling methods

Spray type (refrigerant contact)

The liquid is stored and opened on the top of the chassis. According to the location and calorific value of the heating body, the cooling liquid is allowed to spray the heating body to achieve the purpose of equipment cooling. The sprayed liquid is in direct contact with the cooled device, which has high cooling efficiency

Submerged (refrigerant contact)

In single-phase immersion liquid cooling, electronic fluorinated liquid remains in liquid state. The electronic components are directly immersed in the dielectric liquid, which is placed in a sealed but easily accessible container, and the heat is transferred from the electronic components to the liquid. Typically, a circulating pump is used to flow the heated electronic fluorinated liquid to the heat exchanger, where it is cooled and recycled back to the container.

Single phase immersion liquid cooling

Two phase immersion liquid cooling (liquid and gas)

In two-phase immersion liquid cooling, the heat transfer efficiency of electronic fluorinated liquid is improved exponentially through the boiling and condensation process of electronic fluorinated liquid. The electronic components are directly immersed in the dielectric liquid in the container, which is sealed but easy to operate. In the container, heat is transferred from the electronic components to the liquid and causes the liquid to boil to produce steam. The steam condenses on the heat exchanger (condenser) in the container and transfers heat to the facility cooling water circulating in the data center.

Two phase immersion liquid cooling

Cooling plate (refrigerant non-contact)

Direct to chip cooling, the liquid medium is circulated through the pump and dissipated through the cold plate assembled to the electronic components. The liquid does not come into direct contact with electronic equipment. Although non dielectric liquids (such as water / glycol) are usually used for direct chip cooling, dielectric electronic fluorinated liquids can also be used for direct chip applications to reduce the risk of leakage and improve the reliability of hardware / IT equipment. Direct chip cooling can be achieved using single-phase and two-phase technologies.

Direct chip cooling

Two phase liquid cooling Two phase liquid cooling

Single phase liquid cooling Single phase liquid cooling